Primarily used as a curing agent for epoxy resins.
Product features: 1. Low viscosity at room temperature, low hygroscopicity, suitable for low-temperature application and long-term storage.
2. Long pot life with epoxy resins, slow curing speed, and low curing shrinkage.
3. Low dosage, cured products exhibit excellent heat resistance and weather resistance.
4. Superior chemical resistance, aging resistance, and radiation resistance.